Source Gangtise Investment Research

analysts saidoriginalcrashbandicoot, glass substrate packaging has the advantages of thermal stability, high pass hole density and thin and light design, and is suitable for artificial intelligence chips. Investment opportunities may be concentrated in equipment and materials, especially for precision equipment and new materialsoriginalcrashbandicootdemand growth. It is expected that Samsung will start mass production of glass substrate packaging technology in 2026 and Intel in 2027. Experts say Samsung is expected to make progress in glass substrate technology faster than Intel because its uses are clearer and Intel needs to meet higher standards. Domestic glass substrates have made major breakthroughs in the application of companies such as Huawei and Xiaomi.